We are glad to announce that Xpeedic released the 3D Via Modeling and Simulation —— ViaExpert 2018 this month.
ViaExpert2018 is an industry-leading via modeling and simulation tool. It supports remote and distributed simulation that are managed by Xpeedic Distributed Processing Management(XDPM), manual wiring, and Keepout parameterized library and CMF/SMP modules to provide better solutions for design optimization of 56Gbps and higher speed system.
What's new in ViaExpert 2018
Support HPC, remote and local simulation under the management of XDPM (Xpeedic Distributed Processing Management) module to maximize high computing machine availability.
Unify simulation jobs submit and status monitor flow in "Submit Job" and "Job Manager" to support more user-friendly and real-time feedback batch run.
Support arbitrary parameterized keepout definition, management and usage in 2D footprint window to explore the optimal antipad geometry. The keepout shape can be defined by the unite of lines/arcs or regular parameterized geometries.
Adjust 2D footprint window features to "Footprint"page and categorized as "Via", "Trace", "Port", "Keepout"and “Component” to give user intuitive and convenient operation links.
Support single-ended and differential manual routing with obstacle avoidance capability.
Support arbitrary via array define, move, duplicate, align top/bottom/left/right, distribute horizontally/vertically, undo and redo features in 2D footprint window.
Add CMF and SMP template to quick build and explore capacitor and SMP performance.
Support the RLC boundary to add RLC circuits in serials or in parallel, also mark RLC boundary position for both 2D/3D view if added.
Add "Material Library" module to unify frequency dependent material define, modify, export and re-use flow across different projects, and even different teams.
Support showing or hiding metal layers in the 2D footprint window.
Support parametric of layer thickness, trace width with multiple segments for both template and layout flow and combined anti-pad, also export parameterized parameters to HFSS.
Code-level integration of SnpExpert basic S-parameter and TDR plot features to give user more user-friendly flow to explore simulation results.
Support easy and efficient Allegro to ViaExpert plugins, export allegro layout to ViaExpert with only one-click based on net selection.
Support opening ViaExpert project by double click.
Automatically save ViaExpert project status and user settings at user defined interval.