Overview

Fluid dynamics (CFD) simulation is very critical in engineering and scientific research fields. Recently, with the rapid development of communication equipment, smart phones, data center servers and automotive power devices, chip design faces too many challenges such as high performance, high power, high integration, miniaturization, high temperature resistance, and high reliability. On the one hand, the physical structure and electrical performance should meet the requirements of the chip specifications. On the other hand, the thermal management of chips/devices/modules/systems becomes more and more important. The overheating in operation would cause hardware failure or performance degradation, accelerate the aging of electronic components, and reduce the service life of hardware devices. Therefore, the heat dissipation of the hardware structure should be considered in advance at the design stage . The traditional evaluation relies too much on the measurement and reverse optimization iteration of hardware products, and lacks the simulation tools to predict the results. So it is necessary and urgent to build 3D system-level fluid analysis and simulation flow for electronic systems. The simulation and optimization capabilities of the software will help identify heat dissipation risks and shorten development cycles in order to accelerate product go-to-market.

Key Features

Xpeedic provides a 3D system-level fluid analysis software of Boreas focused on numerical simulations of fluid motion and heat transferring. Boreas adopts a fully self-developed solver engine and intelligent meshing technology to support thermal analysis of natural and forced convection environments from chip, package, board level to the entire electronic integrated system, especially for flow-thermal coupling phenomena in complex environments. It can be widely used in semiconductor, communication, intelligent terminal, automotive electronics, power equipment, industrial automation equipment and medical equipment and other fields. In addition, Boreas breaks through the limitation of single physical field in traditional thermal analysis software. Relying on Xpeedic’s XEDS, Boreas integrates the multi-physics analysis of electromagnetic, thermal, fluid, force and so on, and constructs a complete multi-physics simulation platform. Thus, it can simulate the complex physical phenomena of the electronic system in the real working environments.