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More>>Santa Clara, CA — Apr 7, 2022 —Xpeedic today released Hermes PSI, a new SI PI analysis platform for package a
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More>>Hermes 3D:3D Full-Wave Electromagnetic Simulation of Package and Board*Hermes 3D offers efficient three-dimensional f
More>>Innovative solver technologies and prosperous foundry/package partner ecosystem
The rise of IoT, AI and big data are pushing the advances in IC, packaging, and system, posing great challenges to the EDA industry. The traditional design methodology or even the underlying algorithm must be revised to meet the new demand arising from the new technology. Xpeedic was founded with this new requirement in mind and committed to offer the EDA/IC solution to better serve this rapidly growing market