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IMS Virtual 2021

Date: June 20-25, 2021

A Virtual Experience

Xpeedic will showcase its latest RF solution at the 2021 IEEE MTT-S International Microwave Symposium (IMS) .

Xpeedic enhances its 5G RF solution spans from IC, filter, to package. Its on-chip passive modeling and simulation tool IRIS, certified by foundries, helps RFIC designers to achieve first-pass silicon success. Its package extraction tool Metis enables fast package extraction for RF SiP. Its filter design tool XDS provides a complete flow from schematic, layout, to post-layout simulation to design IPD, SAW, and BAW filters. Xpeedic RF solution further enables RF front end miniaturization with the IPD designs from spec to volume production.

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Xpeedic will also announce its “Multi Scale IC-Interposer-Package Co-Simulation Platform” . It fully supports simulation from micrometer to centimeter level, supports multiple chip and package layout formats, and can realize co-simulation across different sizes, helping designers efficiently solve design challenges from advanced technology and advanced packaging.

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Date

Jun 20-25th, 2021

Place

Online
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