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DesignCon 2021

  • Date: Aug 16-18, 2021

  • Location: San Jose, CA

  • Booth#: 913

Xpeedic Technology, Inc. will exhibit at DesignCon 2021 at San Jose on Aug 16-18, 2021.

DesignCon is the premier conference for chip, board and systems design engineers in the high speed communications and semiconductor communities. The DesignCon Expo Hall offers the latest products and technologies in signal integrity and high-speed design for your current and future projects. You can test and compare emerging tools and technologies from top tier vendors.

At Booth 913, Xpeedic will showcase its simulation-driven EDA solutions across chip, package and system levels for next generation high-frequency, high-speed intelligent electronic products.

Featured solution includes:

  • 2.5D/3D advanded packaging EDA platform


  • High Speed Digital SI/PI Analysis EDA Platform


What's more, Xpeedic will also publish 2 papers at DesignCon2021. Details are as follows: 

Optimizing BGA Ball Pattern for Signal Integrity

  • Track:  01.Signal & Power Integrity for Single-Multi Die, Interposer & Packaging

  • Authors: Xing Wang, Lisa Wei, Mengting Liao (Cisco), Joshua Wan, Feng Ling (Xpeedic)

  • Time: Wednesday, Aug 18, 3:00-3:40pm

  • Location: Exec Ballroom 210A


Signal Integrity Analysis in Immersion Liquid Cooling

  • Track:  06. System Co-Design: Modeling, Simulation & Measurement Validation

  • Authors: Dan Liu, Chunjia Sun (Alibaba), Wei He, Joshua Wan (Xpeedic)

  • Time: Wednesday, Aug 18, 2:00-2:40pm

  • Location: Meeting Room 212AB


More details to see here.


Aug 16-18, 2021


San Jose,CA
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