Date: Aug 16-18, 2021
Location: San Jose, CA
Xpeedic Technology, Inc. will exhibit at DesignCon 2021 at San Jose on Aug 16-18, 2021.
DesignCon is the premier conference for chip, board and systems design engineers in the high speed communications and semiconductor communities. The DesignCon Expo Hall offers the latest products and technologies in signal integrity and high-speed design for your current and future projects. You can test and compare emerging tools and technologies from top tier vendors.
At Booth 913, Xpeedic will showcase its simulation-driven EDA solutions across chip, package and system levels for next generation high-frequency, high-speed intelligent electronic products.
Featured solution includes:
2.5D/3D advanded packaging EDA platform
High Speed Digital SI/PI Analysis EDA Platform
What's more, Xpeedic will also publish 2 papers at DesignCon2021. Details are as follows:
Optimizing BGA Ball Pattern for Signal Integrity
Track: 01.Signal & Power Integrity for Single-Multi Die, Interposer & Packaging
Authors: Xing Wang, Lisa Wei, Mengting Liao (Cisco), Joshua Wan, Feng Ling (Xpeedic)
Time: Wednesday, Aug 18, 3:00-3:40pm
Location: Exec Ballroom 210A
Signal Integrity Analysis in Immersion Liquid Cooling
Track: 06. System Co-Design: Modeling, Simulation & Measurement Validation
Authors: Dan Liu, Chunjia Sun (Alibaba), Wei He, Joshua Wan (Xpeedic)
Time: Wednesday, Aug 18, 2:00-2:40pm
Location: Meeting Room 212AB
More details to see here.
Aug 16-18, 2021