• Date: June 2-7, 2019

• Place: Boston, US

• Booth#: 210

Xpeedic Technology will showcase its latest solutions at the 2019 IEEE MTT-S International Microwave Symposium (IMS) in Boston Convention & Exhibition Center, June 2-7.

Featured as in-booth demos will include

IRIS, Virtuoso-integrated EM simulation tool with the state-of-the-art 3D planar solver

• Certified on multiple foundries' advanced process nodes and proven on RF IC designs including 5G mmWave.

Metis, IC-package co-simulation tool

• IC-package co-simulation tool to enable system-in-package designs. It also supports advanced packaging technologies such as 2.5D interposer with TSV.

IPD for RF FE module design

• Advanced IPD technology to enable passive integration for RF front end, helping customers to achieve faster design convergence from spec to volume production.

Through Glass Via (TGV) solution in collaboration with Corning

• Through Glass Via technology has become a promising technology candidate to realize integrated, low cost and high performance passive devices. A diplexer built with TGV shows less in-band insertion loss and greater out-of-band rejection yet still compact size.

Xpeedic will also present at IMS MicroApps Theatre

• Title: Integrated Passive Devices (IPD) for RF Front End Integration (WEMA35)

• Time: June 5, 12:30-12:45