FROM IC To SYSTEM

Integrated Passive Devices

System in Package

IC MODELING & SIMULATION

The analog/mixed-signal IC software tools help IC engineers to shorten their design cycle at the latest advanced semiconductor nodes.

HIGH SPEED SIGNAL INTEGRITY

The signal integrity software tools enable faster design closure for IC package and PCB system designs.

SYSTEM MINIATURIZATION

The growing IP portfolio on IPD delivers the industry-leading combination of performance and integration to enable SiP for RF front end module designs.

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Accelerate your IC design

Demand for mobile communication and instant access to information has driven the growth of the semiconductor, and challenged all aspects of its supply chain, from IC design, foundry, packaging to system, and thus posed even greater challenges to the EDA/IP industry.

Xpeedic was founded and committed to offer the innovated EDA/IP solution to better serve this rapidly growing market.

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Electronic Design Automation

Full wave EM solver engine based IC-package-system modeling, modeling and SI tools.
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Integrated Passive Devices

Silicon and glass based integrated passive devices IP and customized IPD design service
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System in Package

IPD technology based System in Package design service

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About Us

Xpeedic Technology, Inc. is a global leading provider of EDA software, Integrated Passive Device (IPD), and System-in-Package (SiP) design solution.

Our mission is to help customers with high performance EDA tools and differentiating electronic design solutions in the area of high speed digital designs, IC package designs, and RF analog mixed-signal designs.

Our tools and solutions have been widely adopted by companies who make mobile and IoT devices, computing and network systems.

Detail

  • OUR TEAM

    Our management team and 100+ engineering team have extensive experience in developing industry-leading EDA software and a proven track record for successfully delivering engineering service projects.

  • Our CUSTOMERS

    Xpeedic is the provider for the largest IC design company and the largest foundry in China. It is widely adopted by advanced IC design, packaging and system integration companies.

  • OUR INVESTORS

    Xpeedic has raised three funding rounds since its founding, and the latest Series-B is from China Fortune-Tech Capital and Shanghai Capital.

  • OUR OPERATION CENTER

    China Shanghai、Suzhou
    US Cupertino, Seattle