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Detail

Xpeedic Announces Major Release

of its High Speed SI and

RFIC EDA Tools

Xpeedic

EDA, IPD, SIP Leader

Detail

EDA

RFIC Solutions

DETAIL

EDA

Hight Speed SI Solutions

DETAIL

IPD

Integrated Passive Devices

DETAIL

SiP

System in Package

DETAIL

RFIC Solution

Xpeedic RFIC solution is Xpeedic’s flagship product tailored to RFIC applications, which includes RFIC passive extraction tool, fast PDK model generation tool and RF passive PDK verification tool.

High Speed SI Solution

Xpeedic’s high speed SI solution provides a fast and accurate way to model and simulate the discontinuities along the path and optimze the channel performance.

Chip Miniaturization Solution

Xpeedic’s standard and customized RF front end IPD solution and SiP solutions provide a shortcut for 3D miniaturization

Accelerate your IC design

With IoT and intelligent terminal industry booming, SiP, IPD and the corresponding EDA tools have become major forces behind the development of modern wireless and mobile communication.
After more than four years growth, Xpeedic has made remarkable achievements in these three segment for design cycles shorten, integrated miniaturization, and system integration. Xpeedic has the absolute leadership position in the Chinese market.

About Us

Founded in 2010 by a team of industry experts, Xpeedic is a global leading provider of EDA software, IPD, and turn-key SiP design solution.

Our mission is to help customers with high performance
EDA tools and differentiating electronic design solution in the area of high speed digital designs, IC package designs, and RF analog mixed-signal designs.

Our tools and solutions are widely adopted by the companies making smartphone, tablet, wearable devices and high speed data communication devices.

  • Our Team

    Our management team and 50+ engineering team have extensive experience in developing industry-leading EDA software and a proven track record for successfully delivering engineering service projects.

  • Our Customers

    Xpeedic is the provider for the largest IC design company in China, the largest foundry in China and widely adopted by advanced IC design, packaing and system integration companies.

  • Our Investors

    Xpeedic has raised three funding rounds since its founding, and the latest Series-B is from China Fortune-Tech Capital and Shanghai Capital.

  • Our Operation Center

    China Shanghai、Suzhou
    USA Seattle

soi-banner

Xpeedic Joins the SOI Industry Consortium

Shanghai, China, August 8th – Xpeedic Technology announces today that it has joined the SOI Industry Consortium as a full member. The SOI Industry Consortium is formed by a group of leading companies from the electronics industry with the mission of accelerating silicon-on insulator (SOI) innovation into broad markets by promoting the benefits of SOI technology and reducing the barriers to adoption.
lenovo

Lenovo Adopts Xpeedic High Speed SI Solution

Shanghai, China. — Aug 30, 2016 —Xpeedic, a global supplier of EDA and IP solution in RF and high speed market, recently announced that Lenovo Technology has adopted Xpeedic’s high speed SI solution for system level high speed signal integrity analysis within its server product design.