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The Internet of Things (IoT) is opening the potential for billions of connected smart devices to communicate with each other. Wearables, smart homes, smart cities and industry 4.0 are driving wide range of applications fueling today's IoT market growth.

The IoT enables almost any system to leverage the Internet and the eco-system of Cloud Computing in order to innovate and make a diverse range of objects smarter and more aware. The exponential growth in the number of internet-connected devices is driven by the broad availability of high quality, reliable wireless connectivity, as well as low cost low power embedded components.

Although IoT devices come in many different form factors, they all require common functional building blocks such as data processing,communication module. And Data security, sensor and drive connections, signal and power integrity should be considered. With those demands, however, come the great challenge of delivering increasingly complex IoT devices while reducing the cost and power consumption.

Xpeedic's Industry-leading IoT Solution

Xpeedic IoT solution is addressing the challenges of signal integrity, power integrity, and RF system optimization in the design of intelligent interconnected products. The solution includes the electronic design automation for IoT devices, 4G/5G/NB-IoT network related chips/packages/circuit boards/communications, and electronic components and complete communication systems in smart cars. You can quickly optimize your design without spending a lot of time building and testing costly prototypes.


IRIS for on-chip passive modeling

Metis  for package extraction  

Metis for interposer modeling

Metis for IC/package co-simulation

Hermes for package /substrate simulation

Hermes for package/PCB co-simulation

A suite of tools for High-speed PCB SI simulation 

SI simulation for connector and cable design

Heracles for high-speed PCB automated SI sign-off


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