Hermes 3D:3D Full-Wave Electromagnetic Simulation of Package and Board

Experiment and Simulation Studies on Resonances due to Period Structure in PCBs

High-Speed Digital SI/PI Simulation Platform

A Complete EM Simulation Suite for On-Chip Passives in Advanced Nodes

2.5D/3D IC Advanced Packaging Analysis Platform

RF PCB EM-Circuit Co-simulation Platform

Automated Crosstalk Scan, Impedance Scan and DRC+ for Signal Integrity Signoff

Fast and Accurate Fiber Weave Modeling and Simulation

Accurate Dk/Df Extraction for High-speed SI Applications

IEEE P370 Compatible De-embedding and Quality Check for Measured S-parameters up to 50Ghz

Combined IRIS-HFSS Flow for Passive Modeling and Verification in TowerJazz RF and HPA Nodes

Fast Full Board Crosstalk Scan for Signal Integrity Sign-Off for High Speed PCB Designs

An Empirical Model for Foamed High-Speed Cable

Integrating IRIS Plus in Nuhertz FilterSolutions to Enable Fast Filter Design

Combined IRIS-HFSS Flow for Passive Modeling and Verification in Advanced Process Nodes

Through Glass Via (TGV) Based Integrated Passive Device Technology for RF Front End Design

How to Batch/Sweep Analysis of DDR Emulation

How to Quickly Create the Symbol in Genesis by Using the Automatic Database Building Function of PDF

How to Calculate the RL Parameters for Each Pin

How to Quickly Implement Integrated Modeling of PCB and Connectors

How to Quickly Calculate the DC Resistance of Interposer RDL Routing in Metis

How to extract package thermal resistance in Notus

How to implement PCB board thermal simulation in Notus

How to extract packaging RLGC parameters by X3D of Hermes

How to implement fast DC simulation based on PowerTree

How to add different ports in Metis

How to perform electrothermal co-simulation in Notus

How to create Coaxial Cable and run simulation in Hermes 3D

How to use XHPC to improve simulation efficiency in XDS

How to quickly reuse Module Routing in Genesis PCB

Fast VTF Calculation of UCIe Protocol by SnpExpert

Power Integrity DC Flow

Channel Analysis Flow In High Speed Digital Design

3D Flow in Metis

TmlExpert: 2D, 2.5D, and 3D EM Analysis of Transmission Lines

ChannelExpert: Analysis of Pre-Layout SerDes Channel

Genesis: New Board-level System EDA Platform

XDS: RF and Filter Design Analysis Software

Metis: EM Simulation Software for Advanced Package Design

Hermes PSI: SI/PI/Thermal Simulation Platform

IRIS: Fast EM Simulation with Virtuoso Integration

ViaExpert: 3D Via Modeling and Simulation

JobQueue: Simulation Job Management Platform

TmlExpert: Transmission Line Modeling and Simulation

iModeler: Fast PDK Model Generation

CableExpert: Fast and Accurate Cable Modeling and Simulation

Hermes 3D: High Speed PCB Signal Integrity Analysis

ChannelExpert: High Speed Channel Exploration

SnpExpert: S-Parameter Exploration

Heracles: Automated SI Signoff for High Speed Design

iVerifier: RF Passive PDK Verification

LibManager: Library Management Platform

Design and Simulation of Photonics Computing Chip Base on Chiplet-based Heterogeneous Integration

Study of TDR impedance and loss based on modified Cannonball-Huray roughness model

Automatic Synthesis for On-chip Transformer

Experiment and Simulation Studies on Resonances due to Period Structure in PCBs

Signal Integrity Analysis in Immersion Liquid Cooling

Optimizing BGA Ball Pattern for Signal Integrity

Skew Measurement of High-Speed Connector