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EDA

EDA

●	Multiple home-grown proprietary solver technologies, covering both electromagnetic and circuit simulation domains;
●	AI-based mesh technology, supporting multi-scale simulation needs from nano-meter to centimeter level;
●	Advanced multi-core and multi-machine parallel computing technologies, realizing Xpeedic EDA cloud solution on AWS.

Find the right software for you

HSD SolutionIC SolutionPackage SolutionCloud Solution

ViaExpert – Via Modeling and Simulation

ViaExpert – Via Modeling and Simulation

Via discontinuities in signal paths have significant impact on signal integrity for high speed designs A quick way to build via models and then simulate them is essential for SI engineers ViaExpert is made specially for this purpose To quickly build vi

SnpExpert – S-parameter Exploration

SnpExpert – S-parameter Exploration

SnpExpert provides a quick way to explore S-parameters for SI engineers to understand the electrical characteristics of interconnects, connectors, packages, and systems

CableExpert – Fast and Accurate Cable Modeling and Simulation

CableExpert – Fast and Accurate Cable Modeling and Simulation

Cable is commonly seen in high-speed systems Accurate modeling and simulation are necessary for signal integrity purpose It is a challenge to build accurate model and simulate it in an efficient way CableExpert offers a quick way to build 3D model with

TmlExpert – TML Modeling & Simulation

TmlExpert – TML Modeling & Simulation

Accurate transmission line modeling is essential for high-speed PCB system The requirement can be very different ranging from a simple 2D RLGC simulation to a complicated 3D simulation TmlExpert is built with the consideration of all the

ChannelExpert – Channel Exploration

ChannelExpert – Channel Exploration

It is challenging for digital system designers to simulate high-speed SerDes channels There are many different simulation scenarios to cover ranging from pre-layout post-layout, frequency-domain time-domain statistical analysis, compliance check, to TX R

Heracles – Automated SI Signoff for High Speed Design

Heracles – Automated SI Signoff for High Speed Design

Heracles was the first SI signoff tool for high speed designs, and integrated a novel hybrid full-wave EM solver with the same accuracy order as the conventional 3D solver but an order of magnitude faster speed is developed

Hermes PSI - PI/SI Analysis Platform

Hermes PSI - PI/SI Analysis Platform

BackgroundHigh speed power and signal analysis is becoming more and more challenging because of the ever-increasing

XDS – Xpeedic RF Design and Simulation Platform

XDS – Xpeedic RF Design and Simulation Platform

XDS is the leading EDA platform across all design phases including schematic to layout as well as IC-PKG-System and Circuit-EM co-simulation for RFFE filters and RF system to optimize performance, cost and time-to-market

IRIS – RFIC Passive Extraction

IRIS – RFIC Passive Extraction

Xpeedic IRIS provides high frequency silicon design engineer a 3D fast EM simulation tool integrated in Cadence Virtuoso design flow to analyze on-chip passive devices IC designers now have an automated way to access EM analysis of passive devices withou

iModeler – Passive PDK Model Generation

iModeler – Passive PDK Model Generation

iModeler allows PDK engineers to stay inside Cadence Virtuoso to create the layout and run EM simulation The built-in fast 3D full-wave solver yields both accuracy and efficiency for PDK models

iVerifier – Passive PDK Verification

iVerifier – Passive PDK Verification

PDK model quality is essential for designers to design ICs with confidence Typically PDK models are in the form of parameterized formula as function of physical parameters of the device

HERMES 3D – 3D EM Simulation for Package and Board Designs

HERMES 3D – 3D EM Simulation for Package and Board Designs

Impedance discontinuity in the signal path has a significant impact on signal integrity for high speed channel design

Metis – Fast EM Simulation for Advanced 2.5D/3D Packaging

Metis – Fast EM Simulation for Advanced 2.5D/3D Packaging

Metis provides an efficient way to extract package models with its 3D accelerated Method of Moments (MoM) electromagnetic solver

JobQueue – Simulation Job Queue System

JobQueue – Simulation Job Queue System

JobQueue is a web system to manage your HFSS job, based on Client Server mode, so it’s quite easy to deployment, once you set up all required preconditions in server side, others from world-wide can use this system with only IE Browser Also it’s easy

LibManager – Library Management Platform

LibManager – Library Management Platform

LibManager is a web-based library management system This system is used to import, search and manage various libraries, including HDL, IPD and PDK The system provides operational history information and version control of the library As a web applicati

Xpeedic Simulation EDA for IC-Package-System

Support advanced process and packaging to enable next-generation integrated system

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