Multi-physics Simulation

Boreas——System-Level 3D Fluid Simulation Platform

Overview 

1696749638582079.jpg

Boreas is Xpeedic’s system-level 3D fluid analysis platform for electronic systems, focusing on the numerical simulation of fluid motion and heat transferring. Boreas supports thermal analysis of natural or forced convection environments from chip, package, board level to the entire electronic system, especially flow-thermal coupling phenomena in complex environments. It can be widely used in semiconductor, communication, intelligent terminal, automotive electronics, power equipment, industrial automation equipment, medical equipment and other fields.

 

The intuitive operation interface and convenient analysis flow of Boreas greatly reduce the learning cost of beginners and help complete the simulation of complex electronic systems more efficiently.


1745896613496958.png


Key Features

1696749638582079.jpg

  • Multiple simulation and optimization scenarios: Support chip-level, package-level, board-level, system-level and environment-level heat dissipation simulation. It enables natural heat dissipation, air cooling, liquid cooling and other analysis scenarios.

  • Simpler model editing: Boreas supports importing MCAD file formats such as XDB, STP, SAT, DXF, XT, IGES, etc. It has built-in geometry editing function, which is convenient for users to modify the model directly, as well as customized 1D/2D/3D graphics supporting. The simulated model can be generated parametrically and edited by Boolean operation, graphics arrangement, graphics scanning and other operations.

  • Fast conversion for layout files to 3D models: The built-in Switch to Boreas function of XEDS platform allows users to quickly convert stacked layout files (brd, mcm, sip, etc.) to 3D geometric models and make it seamlessly integrating into the Boreas simulation design flow.

  • High efficiency simulation engine: Support steady-state thermal analysis, transient thermal analysis, conduction analysis, convection analysis and flow-thermal coupling analysis. According to the analysis type setting, Boreas reasonably calls the solving algorithm and meshing method to complete the heat dissipation simulation through the finite element method or the finite volume method, and matches the solution technology for different types of engineering problems.

  • Intelligent adaptive meshing technology: Support AMR technology and various Mix / Hexahedral / Tetrahedron mesh types. It enables CFD fluid boundary layer generation. It can also generate high quality body-fitting meshes for complex geometric models, and complete reasonable mesh transition between dense and sparse regions.

  • Multiple high-precision simulation scenarios: Support real temperature distribution effect and flow field distribution, and gravity settings, radiation settings and multiple turbulence modes.

  • Various post-processing functions: Quickly generate temperature, velocity, pressure and thermal conductivity distribution diagram. It enables users to view the 2D results and the system to automatically generate post-processing reports.

  • Unified multi-physics simulation platform: Relying on Xpeedic’s XEDS, Boreas integrates the multi-physics analysis of electromagnetic, thermal, fluid, force and so on, and constructs a complete multi-physics simulation platform. Thus, it can simulate the complex physical phenomena of the electronic system in the real working environments.

1745896740551060.png

1745896758456938.png