• Suzhou, 2015.5.8
  
  

The IEEE MTT-S International Microwave Symposium (IMS) is the premier annual international meeting for technologists involved in all aspects of microwave theory and practice. It consists of a full week of events, including technical paper presentations, workshops, and tutorials, as well as plenty of opportunities to meet and network with friends both new and old. The symposium also hosts the largest RF/Microwave commercial exhibition in the world with over 550 Companies. The IMS 2015 will be held at Phoenix, AZ on May 17-22, 2015.

Dr. Feng Ling, CEO of Xpeedic, will organize a full-day workshop titled as “RF System Miniaturization with Integrated Passive-Device (IPD), Through-Silicon-Via (TSV), and System-in-Package (SiP) Technologies” on May 17, 2015. The workshop assembles a group of well recognized experts  from Xpeedic, Skyworks, STMicroelectronics, Amkor, ON Semi, STATSChipPAC, IPDiA, and Mentor Graphics to share with the IMS attendees their approach for RF front end miniaturization. The experts represents all the aspects of the entire RF ecosystem ranging from IPD/TSV/Package foundries, design houses, to EDA tool vendors. More details can be found at  http://www.ims2015.org/workshops/6-technical-program/technical-program-general-content/254-sunday-workshop-descriptions#WSK

Xpeedic is proud to be an Exhibitor at the IMS 2015 and can be seen at Booth #2612.

Xpeedic will also exhibit at Booth #2612, showcasing their EDA tools, IPD and SiP solution to enable the RF front end miniaturization. Its EDA tool suite IRIS/iModeler/iVerifier, seamlessly integrated with Cadence Virtuoso, enables fast electromagnetic modeling and extraction for RFIC designers and PDK engineers. Its silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications.