Press Release

Xpeedic Announces Major Release of its High Speed SI and RFIC EDA Tools

Shanghai, China. — Jan 15, 2016 —Xpeedic announces the new major software release of its flagship high speed SI and RFIC EDA tools with the latest 2016.01 version. These tools will be showcased in Xpeedic’s booth (#323) at this year’s DesignCon in Santa Clara, Calif., Jan 20-21, 2016.


  • HERMES SI enables quick SI analysis for package and board. The powerful 3D EM solver engine combined with the optimized mesh significantly improves the simulation speed and accuracy. It can also support parametric sweep and interface to HFSS and CST.

  • SnpExpert  adds several new features such as eye diagram, Dk/Df extraction from S-parameter, and S-parameter conversion to broadband HSPICE model and rational function model.

  • ChannelExpert adds fast channel extraction and analysis for different backplane system architecture such as the conventional one and the orthogonal direct (OD) one. It allows users to import the board layout files to extract the desired channels and run both frequency domain and time domain simulation. The parametrics support automates the channel simulation with full system coverage.

“In the last two years, we have seen the huge demand for high data rate and high bandwidth, which poses tremendous signal integrity challenges in designing high speed communication systems,” said Mr.Zhu, EDA Platform Manager of ZTE. “Xpeedic's EDA tools have helped us significantly with accurate modeling of impedance discontinuities along the signal path,a rich set of built-in templates, and fast response to our R&D requirements. We are happy to see many new features in the 2016.01 release, which can further improve our productivity.”

“The 2016.01 release is indeed our direct response to customers’ feedback,” said Dr. Feng Ling, CEO of Xpeedic. “We have worked closely with industry leading companies such as ZTE to address their engineering need. With our proprietary fast electromagnetic technologies and the customer-oriented features and modules embedded, SI engineers can greatly benefit from using such tools. ”