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InterPACK 2011

Xpeedic Technology presents a technical paper at the international conference InterPACK 2011 (http://www.asmeconferences.org/InterPACK2011/) being held July 6-8 in Portland, Oregon. Dr. Feng Ling, CEO of Xpeedic Technology, Inc., presents the paper co-authored by Xpeedic Technology, Inc. and Jiangsu Changjiang Electronics Technology Co., Ltd.

  • Paper:  Signal Integrity Analysis for RF System-in-Package Designs

  • Authors: Feng Ling, Xpeedic Technology, Inc.; Jeff Chen, Jiangsu Changjiang Electronics Technology Co., Ltd; Weiping Li, Jiangsu Changjiang Electronics Technology Co., Ltd

  • Session: 8-2 Electrical Analysis of Microelectronic Packages – II

  • When: 2:15 – 3:30 PM, Wednesday, July 6, 2011

  • Where: Marriott Portland Downtown Waterfront 1401 SW Naito Parkway  Portland, OR 97201

The InterPACK conference is the flagship technical meeting of the ASME Electronic and Photonic Packaging Division (EPPD), with the participation of JSME, IEEE-CPMT, and iNEMI.


July 6, 2011


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