Events
DesignCon 2021
Overview
DesignCon is the premier conference for chip, board and systems design engineers in the high speed communications and semiconductor communities. The DesignCon Expo Hall offers the latest products and technologies in signal integrity and high-speed design for your current and future projects. You can test and compare emerging tools and technologies from top tier vendors.
Join Xpeedic team for interactive technical sessions and visit Xpeedic booth #913 to learn about our simulation-driven EDA solutions across chip, package and system levels for next generation high-frequency, high-speed intelligent electronic products.
Technical Sessions
Xpeedic will publish two papers at DesignCon2021. Details are as follows:
Optimizing BGA Ball Pattern for Signal Integrity
Track01: Signal & Power Integrity for Single-Multi Die, Interposer & Packaging
Authors: Xing Wang, Lisa Wei, Mengting Liao (Cisco), Joshua Wan, Feng Ling (Xpeedic)
Time: Wednesday, Aug 18, 3:00-3:40pm
Location: Exec Ballroom 210A
Signal Integrity Analysis in Immersion Liquid Cooling
Track06: System Co-Design: Modeling, Simulation & Measurement Validation
Authors: Dan Liu, Chunjia Sun (Alibaba), Wei He, Joshua Wan (Xpeedic)
Time: Wednesday, Aug 18, 2:00-2:40pm
Location: Meeting Room 212AB
Booth Demo (#913)
Featured solution includes:
2.5D/3D advanded packaging EDA platform
High Speed Digital SI/PI Analysis EDA Platform
DesignCon Resources Download
EDA Solution Brief
2021
Aug 16-18
