EPEPS (Electrical Performance of Electronic Packaging and Systems) is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs.

Tutorial

Dr. Feng Ling from Xpeedic will give a tutorial with Dr. Jonatan Aronsson from CEMWorks  during this virtual event: 

• Title: Addressing EM Simulation Challenges for IC-Package-Board Problems

• Authors: Feng Ling (Xpeedic), Jonatan Aronsson(CEMWorks)

• Time: 9:00-10:00 AM PDT, Oct 17, 2021

Virtual Booth

Featured solution includes:

• 2.5D/3D advanded packaging EDA platform

• High Speed Digital SI/PI Analysis EDA Platform