• Date: 7/30-8/3, 2018

• Location: Long Beach, CA, US

Xpeedic will participate in the 2018 IEEE Symposium on Electromagnetic Compatibility and Signal, Power Integrity (EMC+SIPI) held at Long Beach Convention Center in California, USA on July 30-Aug 3, 2018.

Xpeedic has two papers accepted after a rigorous peer review process and will present them at the following time slots:

Fast Full Board Crosstalk Scan for Signal Integrity Sign-Off for High Speed PCB Designs

• Time: 7/31 4:00PM

• Author: Feng Ling (Xpeedic Technology); Kevin Cai (Cisco Systems, US); Bidyut Sen (Cisco Systems, US)

An Empirical Model for Foamed High-Speed Cable

• Time: 8/2 4:00PM

• Author: Xin Wu (Wandtec (Shenzhen) Optronics Technology); Feng Ling (Xpeedic Technology)

We look forward to meeting you there.

For more details, please click here.