Xpeedic Technology, Inc. will exhibit at CSIA-ICCAD 2022 Annual Conference & Guanngzhou IC Industry Innovation and Development Summit (ICCAD 2022) in Guangzhou on November 9-10, 2022.

ICCAD is a most important annual event for IC design industry in China. The theme of this year's conference is “Bay Area has you, core to the future”. The Conference will discuss the opportunities and challenges faced by the IC industry, especially the IC design industry, and enhance the innovation capability and the integration capability of China's IC industry chain to meet market demands and improve international competitiveness. The conference will create a platform for communication and cooperation for enterprises in all aspects of the IC industry chain, and a platform for communication and cooperation in technology, market, application, investment and other fields for IC design enterprises.

Technical Session

Zachary Su, AE Director, will present“Chiplet Technology and Design Challenges”within EDA and IC Design Service forum on Nov.10.

• Title: Chiplet Technology and Design Challenges

• Presentor: Zachary Su, AE Director, Xpeedic Technology

• Time: Nov.10 13:50-14:10PM

• Overview: Heterogeneously integrated advanced packaging has undoubtedly become one of the most important engines driving the semiconductor industry forward in the post-Moore era. As an important application of advanced packaging technology, Chiplet is considered as a path to achieve better performance and low cost. Under the circumstance that the development of advanced process is limited, Chiplet is expected to be one of the breakthroughs in China's semiconductor industry. Director Su's speech will explain the Chiplet technology, design challenges and EDA solutions.

Booth Demo (#109-110, 140-141)

Featured solution includes:

• System-driven EDA  Simulation Platform