Overview

DesignCon is the premier conference for chip, board and systems design engineers in the high speed communications and semiconductor communities. The DesignCon Expo Hall offers the latest products and technologies in signal integrity and high-speed design for your current and future projects. You can test and compare emerging tools and technologies from top tier vendors.

Xpeedic Technology will showcase its latest solutions at the DesignCon2023 in Santa Clara, Jan 31-Feb 2.

Booth Demo(#633)

Featured Solution Includes:

• 2.5D/3D IC Chiplet Designs with Advanced Packaging

• High Speed Digital SI/PI Analysis

DesignCon2023 Resources Download

EDA Solution Brief

• Hermes 3D_Brief_2022.01_EN.pdf

• 2.5D3D IC Advanced Packaging Analysis Platform.pdf

• HighSpeedSimulationPlatformBrief_2022.01_EN.pdf

• Simulation Driven EDA from Chip Package to System.pdf