Time：May 24

Place：Online

Overview

Xpeedic will participate IEEE EPS Webinar on May 24th, discussing the hot topic of 3DIC Chiplet.

The IEEE Electronics Packaging Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacturing.

Webinar Information

• Title: Addressing Electromagnetic Simulation Challenges for Multi-Die 2.5D/3DIC Designs

• Speaker: Dr. Feng Ling of Xpeedic

• Time: 8AM PDT, May 24th (Friday)

• Moderator: Kemal Aygun

• Abstract: The emergence of multi-die 2.5D/3D IC designs requires fundamental changes for conventional EDA tools and methodologies in terms of system-level architectural exploration, physical implementation, analysis and sign-off, verification, and design for manufacturing. This talk will focus on the challenges and solution for signal integrity analysis of 2.5D/3D multi-die packages. A novel electromagnetic solver delivering unprecedented performance advantages with uncompromised accuracy will be introduced. Benchmark examples on various advanced packaging platforms demonstrate its accuracy and efficiency.

Registration

Click here to register.