• Date: Jan. 19-22, 2016.

• Location: Santa Clara,CA

Xpeedic Technology, Inc. will exhibit at DesignCon 2016 at Santa Clara on Jan. 19-22, 2016.

DesignCon is the premier conference for chip, board and systems design engineers in the high speed communications and semiconductor communities. The DesignCon Expo Hall offers the latest products and technologies in signal integrity and high-speed design for your current and future projects. You can test and compare emerging tools and technologies from top tier vendors.

Xpeedic will showcase its latest technology in high speed signal integrity (SI) solution, which can provide a fast and accurate way to enable engineers to simulate the high speed channel for both pre-layout and post-layout scenarios with great confidence, shorten the design cycle, and thus reduce the time to market.

At the same time, you can also find Xpeedic’s IP on silicon integrated passive devices (IPD) , which delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications.

Visit Xpeedic at Booth #323 to find out more.

Website: http://www.designcon.com/santaclara/