Advanced Packaging
RF
Power Device
Memory
Data Center
Smart Terminal
Signal Integrity
Power Integrity
Electromagnetic Compatibility
Electro-Thermal Analysis
Stress and Reliability
3DIC Chiplet
Radio Frequency System
Planar Antenna
Power Semiconductor Device
CFD Thermal Analysis
Package Substrate
PCB Board
ICCAD 2011
Suzhou, China — Nov 11, 2011
Xpeedic will be exhibiting at 2011 CSIA-ICCAD Annual Conference & China IC Design Industry 10-Year Achievements Exhibition, being held at Xi’an Greenland Pico Int’l Convention & Exhibition Center on Nov. 17-18, 2011.