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Technical Documents

Hermes 3D:3D Full-Wave Electromagnetic Simulation of Package and Board 2022-05-06

Experiment and Simulation Studies on Resonances due to Period Structure in PCBs 2022-04-21

High-Speed Digital SI/PI Simulation Platform 2022-04-21

A Complete EM Simulation Suite for On-Chip Passives in Advanced Nodes 2022-04-21

2.5D/3D IC Advanced Packaging Analysis Platform 2022-04-21

RF PCB EM-Circuit Co-simulation Platform 2022-04-21

Automated Crosstalk Scan, Impedance Scan and DRC+ for Signal Integrity Signoff 2019-02-28

Fast and Accurate Fiber Weave Modeling and Simulation 2019-02-28

Accurate Dk/Df Extraction for High-speed SI Applications 2019-02-28

IEEE P370 Compatible De-embedding and Quality Check for Measured S-parameters up to 50Ghz 2018-02-28

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