Preliminary Modeling
TmlExpert
ViaExpert
CableExpert
iModeler
Layout Design
Genesis
Multi-physics Simulation
IRIS
Metis
Hermes Layered
Hermes X3D
Hermes 3D
Notus
System Verification
ChannelExpert
XDS
Automated Measurement
SnpExpert
MeasureExpert
Cloud-based Management
XPLM
Signal Integrity
Power Integrity
Electromagnetic Compatibility
Electro-Thermal Analysis
Stress and Reliability
3DIC Chiplet
Radio Frequency System
Planar Antenna
Power Semiconductor Device
Power Delivery System
Package Substrate
PCB Board
Smart Terminals
Communication Infrastructure
Data Center
IoT
Automotive Electronics
New Energy
Industrial Equipment
Apr 13&18 Shanghai&Santa Clara
Oct 23-26 San Diego,CA
Nov 11&14 Shanghai&Taipei
Nov 3 Taiwan
Oct 12-13 Changsha,China
May 24-26 San Francisco,CA
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