Preliminary Modeling
TmlExpert
ViaExpert
CableExpert
iModeler
Layout Design
Genesis XLIB
Genesis XPCB
Genesis XPKG
Genesis XSCH
Multi-physics Simulation
XSBR
Hermes Transient
Boreas
Hermes 3D
Notus
X3D
Hermes Layered
Metis
IRIS
System Verification
ChannelExpert
XDS
Automated Measurement
SnpExpert
MeasureExpert
Cloud-based Management
XPLM
Signal Integrity
Power Integrity
Electromagnetic Compatibility
Electro-Thermal Analysis
Stress and Reliability
3DIC Chiplet
Radio Frequency System
Planar Antenna
Power Semiconductor Device
CFD Thermal Analysis
Package Substrate
PCB Board
Data Center
Smart Terminals
Automotive Electronics
Communication Infrastructure
IoT
New Energy
Industrial Equipment
May 14 Santa Clara,CA
Apr 2-3 Santa Clara,CA
Mar 20 Shanghai,China
Jan 29-31 Santa Clara,CA
Nov 29-30 Zhuhai,China
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