尊敬的工程师伙伴，

      我们盛情邀请您参加本月底芯和半导体在美国Santa Clara 2019年DesignCon展会上现场举行的高速SI技能秀活动。

      我们一共准备了八大热门话题，由业内专家现场为您演示并互动讨论。所有参加者，皆有机会获得芯和半导体为您准备的新年礼物一份。

Signal Integrity Demo Highlights

• IEEE P370 compatible de-embedding and quality check for measured S-parameters up to 50GHz

• Through-Only De-embedding (TOD) and optimization based Dk/Df extraction for high-speed and wideband applications

• Quick via modeling and optimization from connector footprint

• Fast SI/PI simulation of 2.5D interposer with TSV

• Fast and accurate fiber weave modeling and simulation

• Automated crosstalk scan, impedance scan and DRC+ for signal integrity signoff

• Automated full channel crosstalk analysis and design margin evaluation for high speed backplane systems

• Web-based passive model management for SI/PI engineers

MEET US AT

DesignCon2019   |    Booth 525