Preliminary Modeling
TmlExpert
ViaExpert
CableExpert
iModeler
Layout Design
Genesis
Multi-physics Simulation
IRIS
Metis
Hermes Layered
Hermes X3D
Hermes 3D
Notus
System Verification
ChannelExpert
XDS
Automated Measurement
SnpExpert
MeasureExpert
Cloud-based Management
XPLM
Signal Integrity
Power Integrity
Electromagnetic Compatibility
Electro-Thermal Analysis
Stress and Reliability
3DIC Chiplet
Radio Frequency System
Planar Antenna
Power Semiconductor Device
Power Delivery System
Package Substrate
PCB Board
Smart Terminals
Communication Infrastructure
Data Center
IoT
Automotive Electronics
New Energy
Industrial Equipment
Oct 24 Shanghai,China
Oct 17 San Jose,CA
Sept 10-11 Shenzhen,China
Sept 24 Santa Clara,CA
Sept 16-17 Shanghai,China
Sept 3 Shanghai,China
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