Xpeedic Technology, Inc. will exhibit at CSIA-ICCAD 2019 Annual Conference & Nanjing IC Industry Innovation and Development Summit (ICCAD 2019) in Nanjing on Nov.21-22, 2019.

ICCAD is a most important annual event for IC design industry in China. It creates a biggest platform for enterprises within China IC industry chain to exchange their expertise and to build up networks. The theme of this year's conference is “Build Chip Ecology, Round Chip Dream”. The Conference will discuss the opportunities and challenges faced by the IC industry, especially the IC design industry, and enhance the innovation capability and the integration capability of China's IC industry chain to meet market demands and improve international competitiveness.

At booth 045-046 , Xpeedic will showcase their latest update in RF front end miniaturization solution and high speed signal integrity (SI) solution in the conference. Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Their fast and accurate SI software enables the quick way to simulate the high speed channel for both pre-layout and post-layout scenarios.

Zachary Su, Application Manager, will also present the leading design method “Enabling SiP Design with Differentiating Simulation Technologies” within EDA and IC Design forum on Nov.22.