Overview 

Metis is Xpeedic’s simulation platform for advanced 2.5D/3DIC Chiplet packaging design. It can be applied to the electromagnetic analysis of die, flip-chip BGA (FCBGA), wafer-level package, multi-Chiplet, 2.5D/3D advanced package, and chip-package co-simulation. The Metis 3D full-wave high-precision electromagnetic simulation engine can meet the efficiency and accuracy requirements of signal and power models in heterogeneous integration, and support multi-scale simulation from nanometer to centimeter level.

Electromagnetic field modeling for advanced packages needs to consider accuracy, efficiency, and ease of use. Metis is an electromagnetic simulation tool based on the method of moments, which can accurately characterize the skin effect and proximity effect of conductors. Intelligent hybrid meshing and automatic mesh Tunneling technology can not only meet the requirements of precision, but also control the grid scale, and provide the possibility of electromagnetic field extraction for large-scale packaging design. Compared with traditional methods, Metis has great advantages in computing speed and memory for various 2.5D/3D package structures.

Key Features 

• Easy operation and supporting complete multi-scenario simulation flows: Metis has already supported signal EM, power DC, power AC and signal transient simulation flows, and easy switching among these processes. The model import, editing, simulation setting and result display can be completed within one step for all simulation flows.

• Visual operation and supporting mainstream format design import:  Support *gds, *brd, *mcm, *sip, dxf, ODB++ and other mainstream format design files. Metis has powerful 2D and 3D structure viewing functions, which is convenient for users to view the structure for port and edit operations before simulation, and allows arbitrary cutting of the layout to simulate the area of interest.

• Electromagnetic analysis of various advanced package scenarios: Metis can quickly and accurately extract signal/power network model parameters. With the built-in 3DIC package simulation Wizard process and multi-design stacking function, it is easy to complete 2.5D/3D advanced package modeling and signal S-parameters, time-domain eye diagram, power DC voltage drop and AC impedance simulation.

• High-speed/high-frequency simulation for ultra-large heterogeneous integrated package and multi-scale electromagnetic analysis: The  MOMSolverPlus solver and intelligent meshing technology are used to balance the completeness of the geometric model and the complexity of the solution scale. It meets the simulation requirements of high-speed/high-frequency applications in very large scale heterogeneous integrated package, and supports multi-scale electromagnetic simulation from nanometer to centimeter level.

• Flexible simulation and efficient multi-task multi-core multi-computer parallel solution: It has three simulation modes of Speed/Balanced/Accuracy correspond to different simulation accuracy and efficiency requirements respectively. The simulation mode and the model type cooperate in advance to help users achieve the best precision-speed trade-off. It meets the different requirements of simulation efficiency in each design step from architecture exploration to sign-off. It supports multi-task, multi-core and multi-server parallel solving technology, which effectively accelerates the simulation speed.

• Easy stacking to help merge multi-design models: It supports bump, wirebond and hybrid bonding structure to interconnect the upper and lower Die, and also supports multi-die media and metal merging mode interconnection modeling. Meanwhile, it has flip, rotate and mirror and other editing operations.

• Customized routing and trace analysis: It supports layout-free pre-simulation and design flow, integrates various transmission lines and Interposer templates. Users can customize the routing according to the Interposer template. Metis projects are automatically generated by the templates, and signal ports are also automatically defined in order to easily conduct interposer routing analysis. The S-parameters are extracted with the Rdc, C, IL, RL, PSNEXT and PSFEXT results generated automatically.