Xpeedic to Exhibit at ICCAD 2018

  • Date: Nov.29-30, 2018

  • Location: Zhuhai, China

  • Booth#: 003-004

Xpeedic Technology, Inc. will exhibit at CSIA-ICCAD 2018 Annual Conference & Zhuhai IC Industry Innovation and Development Summit (ICCAD 2018) in Zhuhai on Nov.29-30, 2018.

ICCAD is a most important annual event for IC design industry in China. It creates a biggest platform for enterprises within China IC industry chain to exchange their expertise and to build up networks. This year, the theme is “Linking Core Power, Leading intelligence of the Great Bay Area”. In this annual general meeting, the Integrated Circuit industry, especially the opportunities and challenges faced by the IC Design industry, will be discussed in details in order to enhance innovation capability and improve the comprehensive capability of Chinese Integrated Circuit industrial chain, thereby satisfying the market demands and boosting international competence.

At booth 003-004 , Xpeedic will showcase their latest update in RF front end miniaturization solution and high speed signal integrity (SI) solution in the conference. Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Their fast and accurate SI software enables the quick way to simulate the high speed channel for both pre-layout and post-layout scenarios.

Dr. Wenliang Dai, co-founder, VP Engineering, will also present the leading design method “Addressing Modeling and Simulation Challenges for IC, Package and System” within EDA and IC Design Service forum on Nov.30.

For more details, please click here.