Overview

DesignCon is the premier conference for chip, board and systems design engineers in the high speed communications and semiconductor communities. The DesignCon Expo Hall offers the latest products and technologies in signal integrity and high-speed design for your current and future projects. You can test and compare emerging tools and technologies from top tier vendors.

Xpeedic Technology will showcase its latest solutions at the DesignCon2022 in Santa Clara, April 5-7.

Technical Session

Xpeedic will publish one paper at DesignCon2022. Details are as follows: 

Experiment and Simulation Studies on Resonances due to Period Structure in PCBs

• Track:  04. Advances in Materials & Processing for PCBs, Modules & Packages, 13. Modeling & Analysis of Interconnects

• Speaker: Yifeng Li  (Shennan Circuits)

• Author: Kai Li, Yifeng Li, Xuechuan Han, Dazhou Ding (Shennan Circuits), Wei He, Zhouxiang Su (Xpeedic)

• Time: April 7, 3:00pm - 3:45pm

• Location: Ballroom D

Booth Demo(#727)

Featured Solution Includes:

• 2.5D/3D Advanced Packaging

• High Speed Digital SI/PI Analysis

DesignCon2022 Resources Download

HighSpeedSimulationPlatformBrief_2021.01.sp1_EN.pdf

Metis_Interposer_Brief_2021.01_EN_v5.pdf

3D Full Wave EM Simulation of Package and Board .pdf

Hermes 3D_Brief_2021.02_EN_v1.0.pdf