DesignCon is the premier conference for chip, board and systems design engineers in the high speed communications and semiconductor communities. The DesignCon Expo Hall offers the latest products and technologies in signal integrity and high-speed design for your current and future projects. You can test and compare emerging tools and technologies from top tier vendors.
Xpeedic Technology will showcase its latest solutions at the DesignCon2022 in Santa Clara, April 5-7.
Xpeedic will publish one paper at DesignCon2022. Details are as follows:
Experiment and Simulation Studies on Resonances due to Period Structure in PCBs
Track: 04. Advances in Materials & Processing for PCBs, Modules & Packages, 13. Modeling & Analysis of Interconnects
Speaker: Yifeng Li (Shennan Circuits)
Author: Kai Li, Yifeng Li, Xuechuan Han, Dazhou Ding (Shennan Circuits), Wei He, Zhouxiang Su (Xpeedic)
Time: April 7, 3:00pm - 3:45pm
Location: Ballroom D
Featured Solution Includes:
2.5D/3D Advanced Packaging
High Speed Digital SI/PI Analysis
DesignCon2022 Resources Download
3D Full Wave EM Simulation of Package and Board .pdf
Apr 5-7, 2022