EPEPS (Electrical Performance of Electronic Packaging and Systems) is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs.

Booth Highlights

As the silver sponsor, Xpeedic will exhibit its latest solutions on 2.5D/3D Chiplet Advanced Packaging EDA Platform and High Speed Digital SI/PI Analysis EDA Platform.