Xpeedic will showcase its latest RF solution at the IMS 2023 in San Diego, CA, June 11-16.
The annual IMS Exhibition is held in conjunction with the IEEE MTT International Microwave Symposium (IMS), RFIC, and ARFTG Technical Symposia and offers an excellent opportunity for all segments of the microwave community to meet.
WEMA23： Overview of Integrated Passive Devices (IPD)for RF Front-end Applications
Speakers：Feng Ling, Lijun Chen (Xpeedic)
Location：MicroApps Theater, Booth 2447
Time：15:00-15:15, Jun 14
Abstract：Integrated passive devices (IPD) have been prevalent in RF front-end modules in both cellular and wireless connectivity applications due to its advantages in terms of compact size manufacturing consistency, integration capability, and low cost. Various technologies such as high-resistivity silicon based and through-glass-via (TGV) based IPD have been developed. Their use in RFFEM for 5G NR filters will be demonstrated and compared. Besides the cellular applications,IPD for IoT and wireless connectivity market is also introduced. Integration of multiple passive functions such as balun, divider, filter, and matching network enables IPD as an all-in-one die for this type of application.
Booth Demo (#1121)
Xpeedic RF EDA/Filter Design Platform to support chip-package-module-board designs:
XDS RF system-level design and simulation platform providing schematic design and simulation, post-layout electromagnetic simulation, EM-circuit co-simulation and tuning/optimization.
IRIS On-chip passive modeling and simulation for RFIC designs with accelerated 3D EM solver, and certified by advanced nodes technologies
iModeler Passive model generation with built-in MoM cap, MiM cap, inductor and transformer templates, parameterized result exploration with built-in templates.
iVerifier Fast passive verification by comparing the EM results of the PDK parameterized models, the neural network training model results, and the SPICE results of the equivalent circuit
Mass-Production Proven IPD IP
IPD-Integrated Passive Device is essentially a passive device integration technology based on silicon or glass . Xpeedic provides RF front-end and on-chip transformer IPD solutions for consumer and industrial markets. The advantages of adopting Xpeedic's IPD solution include:
IP library for filters, power dividers, couplers, baluns, multiplexers, and matching network
Trusted foundry and package ecosystem partners, Supported over 2 billion shipments and dozens of product mass production
The R&D team has excellent capabilities and has been designing hundreds of products for over a decade, accumulating nearly one hundred related patents
Quick turnaround for customization supported by dedicated engineering team and home-made EDA design flow
Xpeedic chip capacitors provide high density, small size and high performance, it is a high-end alternative to MLCC. It has the following characteristics:
High stability over temperature
Signal stability over frequency
Stability regarding voltage
Multi terminal and Customized
Cap Range: 0.1pF~1000nF
Decoupling& ultra broadband applications