Time：Jan 31-Feb 1

Place：Santa Clara, CA

Xpeedic is a Silver sponsor of the 2024 DesignCon in Santa Clara. 

Please visit our booth #627 to learn more about Xpeedic Simulation EDA

Use promo code SPECIAL24 

for a FREE expo pass or 15% off all conference passes.

Booth Demo（#627）

Xpeedic will introduce one-stop EDA solution to SI/PI/Multi-physics analysis for electronic systems, and release the latest updates for high speed digital design and 3DIC Chiplet design in the booth.

• Xpeedic High speed EDA Product Family

• 2.5D/3DIC Chiplet Design Platform

Preview of Demo Highlights

Please click the link to download the product brief and learn more.

• 3D Full-wave EM Simulation Platform for Next-generation Electronic Systems.pdf

• Large-capacity EM Simulation Platform for 2.5D 3D IC Chiplet Design.pdf

• Multi-physics Analysis Platform for PI SI Thermal of Chip,Package and PCB.pdf

• Signal Integrity Simulation and Analysis for Next-generation Digital Systems.pdf

• Xpeedic EDA Overview 2024.pdf