DAC 2022



As the premier conference for the design and design automation of electronic circuits and systems, the 59th DAC (Design Automation Conference) program has expanded to include many verticals closely integrated with and/or dependent on cutting-edge electronic design automation.

Xpeedic Technology will showcase its latest solutions at the 2022 Design Automation Conference (DAC) in San Francisco, July 10-14.

Mini Theater Presentation at Samsung Booth

As a Samsung SAFETM ecosystem partner, Xpeedic will present its 3DIC solution at Samsung Mini Theater in booth #2355.


Booth Demo - EDA Release 2022(#1443)

Xpeedic will release its EDA 2022 edition at DAC2022, with many important functions and upgrades in the areas of advanced packaging, high-speed design and RF EM analysis. Driven by heterogeneous integration and system analysis, Xpeedic EDA 2022 supports both advanced nodes and advanced packaging to enable next generation high-frequency, high-speed integrated system.


EDA 2022 Release Highlights Preview:

2.5D/3D Advanced Packaging

  • 2.5D/3DIC advanced packaging design EM simulation platform, Metis 2022 improved Method of Moments (MoM) solver and delivers better performance and usability. Wizard flows are added for 3DIC and Package design analysis with step-by-step operations. Many advanced functions are improved, including TSV supports, PEC ports, Die-Package stacking enhancements, etc..


  • 3D electromagnetic simulation tool, Hermes 2022 adopted new adaptive mesh technology and brought higher simulation accuracy, and other improvements for usability and performance, such as E/H field display, layout editing, wirebond batch editing, etc..

Circuit Simulation

  • Circuit time domain and frequency domain SPICE simulation platform, ChannelExpert 2022 adds the support of DDR5 ibis/ami model simulation and the function of hierarchical schematic. It also includes other circuit analysis such as statistical, COM, DOE, etc..

High-Speed System

  • Hermes PSI 2022 is a new easy-to-use simulation platform for IC/Package / Board level signal integrity, power integrity, model extraction and electrothermal analysis in high-speed design.

RF Analysis

  • RF system-level design and simulation platform, XDS 2022, provides schematic design and simulation, post-layout electromagnetic simulation, EM-circuit co-simulation and tuning/optimization.


July 10-14

San Francisco, CA