Advanced Packaging
RF
Power Device
Memory
Data Center
Smart Terminal
Signal Integrity
Power Integrity
Electromagnetic Compatibility
Electro-Thermal Analysis
Stress and Reliability
3DIC Chiplet
Radio Frequency System
Planar Antenna
Power Semiconductor Device
CFD Thermal Analysis
Package Substrate
PCB Board
Oct 10-11 Hefei,China
Jun 2-7 Seattle,WA
Aug 9 Beijing,China
Dec 6-7 Chongqing,China
May 5-8 Shenzhen,China
Nov 11 Suzhou,China