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    IC Solution
    IRIS – RFIC Passive Extraction
    iModeler – Passive PDK Model Generation
    iVerifier – Passive PDK Verification
    Package Solution
    HERMES 3D – 3D EM Simulation for Package and Board Designs
    Metis – Fast EM Simulation for Advanced 2.5D/3D Packaging
    System Solution
    ChannelExpert – Channel Exploration
    Notus - PI/SI/Thermal Analysis Platform
    XDS – Xpeedic RF Design and Simulation Platform
    SnpExpert – S-parameter Exploration
    ViaExpert – Via Modeling and Simulation
    TmlExpert – TML Modeling & Simulation
    CableExpert – Fast and Accurate Cable Modeling and Simulation
    Heracles – Automated SI Signoff for High Speed Design
    Genesis - New Board-level System EDA Platform
    Cloud Solution
    JobQueue – Simulation Job Queue System
    LibManager – Library Management Platform
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  • EDA² IDAS设计自动化产业峰会 2023-09-17
  • 芯和半导体在DAC上发布高速数字信号完整性、电源完整性EDA2023软件集 2023-07-11
  • 芯和半导体EDA仿真解决方案厦门研讨会 2023-06-20
  • 芯和半导体在IMS展发布射频EDA解决方案2023版本 2023-06-14
  • Xpeedic Releases RF EDA Solution 2023 at IMS 2023-06-14
  • 芯和高速高频EDA研讨会 2023-05-15
  • ISEDA2023 2023-04-25
  • 芯和半导体:三款“王炸”EDA产品,精准应对高速链路中的“痛点” 2023-04-20
  • 集成电路EDA创新生态发展高峰论坛 2023-04-11
  • 芯和半导体获2023年度中国IC设计成就奖之年度创新EDA公司奖 2023-03-31

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