EDA
Modeling
Design
Multiphysics Simulation
System Verification
Automated Measurement
Cloud-based Management
TmlExpert
TmlExpert
Transmission Line Modeling
ViaExpert
ViaExpert
High-speed Via Modeling
CableExpert
CableExpert
Cable Harness Modeling
iModeler
iModeler
Passive PDK Modeling
Genesis XSCH
Genesis XSCH
Genesis Schematic Design
Genesis XPKG
Genesis XPKG
Genesis Package Design
Genesis XPCB
Genesis XPCB
Genesis PCB Design
Genesis XLIB
Genesis XLIB
Genesis Component Library Design
IRIS
IRIS
Fast On-chip EM Simulation
Metis
Metis
3DIC Multiphysics Simulation
Notus
Notus
Package & PCB Multiphysics Simulation
Hermes Layered
Hermes Layered
Package & PCB High Frequency Simulation
Hermes 3D
Hermes 3D
3D High Frequency Simulation
Hermes Transient
Hermes Transient
System-Level EMC Simulation
X3D
X3D
RLGC Parastic Extraction
XSBR
XSBR
System-Level Scattering Analysis
Boreas
Boreas
System-Level CFD Simulation
Janus
Janus
3D Low Frequency Simulation
ChannelExpert
ChannelExpert
High-speed System Analysis
XDS
XDS
RF System Design
SnpExpert
SnpExpert
S-parameter Exploration
MeasureExpert
MeasureExpert
Automated Measurement and Analysis
XPLM
XPLM
Electronics Design Lifetime Management
LicenseManager
LicenseManager
License Management
JobQueue
JobQueue
HPC Management
LibManager
LibManager
Library Management
Solution
Industry
  • Advanced Packaging

  • RF

  • Power Device

  • Memory

  • Data Center

  • Smart Terminal

Application
  • Signal Integrity

  • Power Integrity

  • Electromagnetic Compatibility

  • Electro-Thermal Analysis

  • Stress and Reliability

  • 3DIC Chiplet 

  • Radio Frequency System 

  • Planar Antenna 

  • Power Semiconductor Device

  • CFD Thermal Analysis

  • Package Substrate 

  • PCB Board 

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Fast EM Simulation for Advanced 2.5D/3D Packaging
RF Design and Simulation Platform
PI/SI/Thermal Analysis Platform
Industry Solutions
Advanced

Chiplet

Advanced Packaging

Solution

Cross-hierarchy co-design and analysis from chip, package to interposer, addressing interconnect,bandwidth and power issues.

RF

RF

Solution

RF EDA solution from "chip, module to system", enabling RF system-level co-optimization.

Memory

Memory

Solution

Memory EDA solution across chip–package–module–board–system

Devices

Power Devices

Solution

Power Device EDA Solution across chip-module-system for electrical performance, thermal management and reliability challenges.

Data

Data Center

Solution

Multi-physics co-simulation from Package, Board to System for data center challenges in high-speed interconnect, power delivery, and thermal management

Smart

Smart Terminals

Solution

One-stop smart terminal solution, enabling simulation from chip, package, PCB to system verification

Application Solutions
Signal Integrity
Signal Integrity
Power Integrity
Power Integrity
Electromagnetic Compatibility
Electromagnetic Compatibility
Electro-Thermal Analysis
Electro-Thermal Analysis
Stress and Reliability
Stress and Reliability
Radio Frequency System
Radio Frequency System
Package Substrate
Package Substrate
3DIC Chiplet
3DIC Chiplet
PCB Board
PCB Board
Planar Antenna
Planar Antenna
Power Semiconductor Device
Power Semiconductor Device
CFD Thermal Analysis
CFD Thermal Analysis
News
  • Xpeedic Releases EDA 2024 Platforms at DAC 2024

  • Xpeedic Release One-stop EDA solution to SI/PI/Multi-physics Analysis at DesignCon2024

  • Xpeedic Takes 2023 3D InCites Herb Reiter Design Tool Provider of the Year Award

More
Events
  • DesignCon 2026

  • DAC2025

  • DesignCon 2025

More
Resources
  • Design and Simulation of Photonics Computing Chip Base on Chiplet-based Heterogeneous Integration

  • Study of TDR impedance and loss based on modified Cannonball-Huray roughness model

  • How to Batch/Sweep Analysis of DDR Emulation

More