Cross-hierarchy co-design and analysis from chip, package to interposer, addressing interconnect,bandwidth and power issues.

RF EDA solution from "chip, module to system", enabling RF system-level co-optimization.

Memory EDA solution across chip–package–module–board–system

Power Device EDA Solution across chip-module-system for electrical performance, thermal management and reliability challenges.

Multi-physics co-simulation from Package, Board to System for data center challenges in high-speed interconnect, power delivery, and thermal management

One-stop smart terminal solution, enabling simulation from chip, package, PCB to system verification